A Review of the
Bellin Dynamic Systems Inc. Snap-Apart Surface
Mount PCB Prototyping Systems
Ryan Shuttleworth, Member Society for Amateur
Scientists
Last November I read an article in The
Citizen Scientist entitled "The
Quest for a 21st Century Prototyping Board " (18 November
2005). This article described an electronics prototyping issue
with which I am all-too-familiar, the need for a fast, low
cost and convenient way to prototype electronics circuits
composed of modern surface mount device (SMD) components.
From the perspective of an electronics designer,
I greatly appreciate the SMD revolution, for it has given
me the ability to concentrate a great deal of functionality
into a very small space. However, from the perspective of
a hobbyist and assembler of these small circuits, I have found
it increasingly difficult to assemble functional prototypes
of designs that incorporate these ever-shrinking packages.
I have examined numerous SMD prototyping systems over the
years and so far only one system has won my loyalty: The “Snap-Apart”
system of Bellin Dynamic
Systems Inc.
The “Snap-Apart” system consists of 127 mm
x 178 mm (5 in x 7 in) sheets of 32 mil FR4 printed circuit
boards (PCBs). Each sheet is scored into numerous small circuits
designed to conveniently support the vast majority of commercially
available SMD packages. Bellin Dynamic Systems offers numerous
assortments of these small circuits, and I encourage the reader
to visit the Bellin
web site to find a collection which best suits his or
her needs.
Figure 1 shows a small section of a larger
127 mm x 178 mm “Snap-Apart” board. As you can see, each of
the small PBC sections consists of the SMD footprint and convenient
through-holes into which you can insert a standard 0.1 in
SIP header. The insertion of the header allows the user to
insert the circuit into a typical prototyping breadboard as
shown in Fig. 4. SIP headers are included with each purchase
of a “Snap-Apart” board.

Figure 1. A small section of one of the many assortments of
“Snap-Apart” SMD prototyping systems.
Not all of the available “Snap-Apart” boards
consist of a single footprint. Many of the boards are double
sided with a different footprint on each side. Other boards
include support circuitry footprints that allow the user to
add components such as SMD bypass capacitors and regulators.
Figure 2 shows a close-up of one such PCB along with a couple
of convenient boards for MSOP-8 and SOT-23-6 support.

Figure 2. A close-up of a multi-function PCB and two convenient
PCBs that support SOT-23-6 and MSOP-8 packages.
Figure 3 is a close-up of some assembled
boards I have used in my prototyping adventures. Clockwise
from the top left you can see a precision, low distortion
60 kHz oscillator, a PIC with reset and supply bypass circuitry,
a mounted RMS to DC IC and a small 12-bit SMD DAC IC.

Figure 3. An assortment of assembled “Snap-Apart” boards.
Figure 4 shows an assembled breadboard prototype consisting
of two half-H-bridge ICs, an SOT-23-3 MOSFET and support connections.
You can see that the “Snap-Apart” PCBs are well suited to
this style of prototyping.

Figure 4. “Snap-Apart” PCBs installed on a breadboard.
As I mentioned above, the “Snap-Apart” prototyping
system is by far the best I have ever used. It has saved me
an enormous amount of time, money and frustration, and I strongly
encourage electronics professionals and hobbyists to examine
the system for themselves. “Snap-Apart” boards are available
directly from Bellin or from their distributor Mouser.
Kits consisting of large assortments of boards are also available
at bulk-discounted prices. 
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